Intel Corp. confirmed that initial production test runs for its most advanced silicon wafer, the 18A, are underway at its Arizona semiconductor plant with plans to ramp up to full volume production later this year, a company executive said during an April 29 event.
Intel (Nasdaq: INTC) achieved a “risk start” manufacturing milestone for its 18A node at its Chandler Ocotillo campus, demonstrating progress in domestic manufacturing of its leading-edge wafers, Naga Chandrasekaran, Intel Foundry chief technology and operations officer, said at the Intel Foundry Direct Connect event held Thursday.
“Intel 18A is the most advanced node that’s developed and ramped here in United States and this node is industry first on several fronts,” he said. “It’s the first gate-all-around technology that will be ramped in high volume manufacturing. It’s the first node to have backside power and offerings to our customers and we are very delighted to have this node achieve the risk start manufacturing milestone.”
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